Passive/Active Combination Heat-Sink with Removable Fan BXSTS300C
Products specifications
Compatible products
|
LGA3647 socket |
ARK ID
|
126284 |
Thermal Design Power (TDP)
|
280 W |
Height
|
64 mm |
Depth
|
88 mm |
Width
|
91 mm |
Package type
|
Box |
Compatible processor series
|
Intel® Xeon® |
Supported processor sockets
|
LGA 3647 (Socket P) |
Type
|
Heatsink |
Suitable for
|
Processor |